The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2011.24
Session ID : 1403
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1403 Thermo-Mechanical Analysis of Laser Anneal Process
Shiro Yoshida
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Abstract
Heating of circular silicon wafer plate under laser annealing is modeled by Non-Linear FEM. Laser source is modeled by concave shaped plate with focus immediately beneath the wafer surface. Heat source is placed over the wafer surface with fixed temperature, and sinusoidal motion. The radiosity is calculated from the geometry around the heat source and the silicon wafer. The chronological change of temperature profile is reported under this situation.
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© 2011 The Japan Society of Mechanical Engineers
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