Delamination analysis of high thermal resistance resin on an interface between dissimilar materials
Hiroshi Nakaido, Takuya Hatao, Katsushi Yamashita, Yui Ozaki, Toru Ikeda, Akiko Ozaki
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Keywords:
High thermal resistance resin,
Power device,
SiC Package,
Delamination,
Plastic Package,
Thermal cycle test
Pages 88-89
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