2016.29
Session ID : 026
Conference information
Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 22, 2016 - September 24, 2016
Evaluation of the delimitation strength of an interface between copper substrate and molding resin in a power module
Yuto NANAZOSHI, Toru IKEDA, Masaaki KOGANEMARU, Hiroaki HOKAZONO, Tatsuhiko ASAI, Yuta TAMAI
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