2016.29
Session ID : 4_276
Conference information
Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 22, 2016 - September 24, 2016
Delamination analysis of high thermal resistance resin on an interface between dissimilar materials in electronic components
Keywords:
High thermal resistance resin,
Power device,
SiC Package,
Delamination,
Plastic Package,
Thermal cycle test
Details
Article 1st page
