Thermal fatigue analysis for aluminium wire bonding of power modules considering transient creep

Abstract

It is important to predict the thermal fatigue life of the wire bonding joint used in power modules. In this study, creep characteristics of aluminum wire which was actually used for power modules were obtained by stress relaxation test. Then, the creep characteristics were used to evaluate the thermoelastic plastic creep behavior of wire-chip joint of power modules. It was found from the FEA results of wire-chip joint during thermal cycle that the stress relaxation caused by the transient creep occurred in aluminum wire.