Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 16, 2019 - September 18, 2019
The power devices are used under the high and low temperature conditions. Therefore, the delamination between encapsulation resin and metallic components becomes a critical issue. In order to develop high reliability encapsulation resins, a technique to evaluate delamination quantitatively is necessary. We have been studying the mechanical fatigue test technique for the interface between encapsulation resin and metal. In this study, we investigated the possibility of adapting the mechanical fatigue test technique to the power device packages. It turned out that the normalized stress intensity factor obtained from the three-point bending test and FEM analysis is important for this technology. The mechanical fatigue test and the thermal cycle test with the same normalized stress intensity factor of crack gave the similar reliability results. As a result, the mechanical fatigue test technique can be applied to the delamination reliability evaluation analysis for power device packages.
