Model order reduction of three-dimensional transient heat transfer analysis to one-dimensional by using Krylov-subspace concerning cooling effect of air

Abstract

In semiconductors packages, heat generation density is increasing due to miniaturization. Since heat generation is caused by voltage input at the packages, electronic components are usually cooled by air. In recent years, electrification is widely spread among many engineering products like motor vehicles, and the amount of semiconductors packages installed in those products as well. To make the electronic components more densely installed, co-simulation of heat transfer analysis and electrical circuits is needed at designing products. In this paper, by using the Krylov-subspace model order reduction method, the accuracy of one-dimensional heat transfer analysis model concerning cooling effect of air is evaluated. By using the method, co-simulated with electrical circuits is possible.