3D Thermal Conduction Analysis Modeling the Actual Filler Dispersion in Thermal Interface Material.

(Derivation and Verification of Filler Interfacial Thermal Resistance)

Abstract

In electronic products, lately increasing thermal radiation is demanding higher thermal conductivity of polymer composites. However, inaccurate observation of filler dispersion within the polymer do not allow for accurate quantification of Interface Thermal Resistance and subsequently prediction of thermal conductivity. Therefore optimum filler design could not be achieved. Firstly in this report, accurate stereoscopic filler dispersion was observed by FIB-SEM. Secondly, quantification of Interface Thermal Resistance could be achieved by thermal conduction analysis using filler dispersion model. Thirdly, this Interface Thermal Resistance enabled prediction of the thermal bulk conductivity. Lastly, prediction made above could be validated by comparison of predicted value and measured value. This result may lead to optimum filler design and thereby to the development of higher thermal radiation materials.