Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 25, 2023 - October 27, 2023
A user subroutine has been ingeniously developed and integrated into the general FEM code ANSYS, dedicated to the evaluation of cure shrinkage stress in UV curable adhesives. Through experimentation, the user subroutine has exhibited exceptional accuracy in computing the relaxation behavior for varying degrees of cure. Moreover, an analysis employing dynamic mechanical analysis has convincingly demonstrated the ability of user subroutine to adeptly capture the intricate interplay between curing degree and frequency, manifesting as phase differences between displacement and stress. Finally, an analysis assuming curing shrinkage was performed. The results proved to be exceptionally encouraging, as the subroutine aptly reproduced the characteristic dependency of illuminance and film thickness on curing stress, which is notably distinctive to UV adhesives.
