Heat Conduction Analysis by Phonon Propagation at Filler Interface using Molecular Dynamics Simulation

Abstract

Thermal Interface Material (TIM) development with high thermal conductivity is necessary for power module of automobile. However, the mechanism analysis of heat transfer between filler and resin in TIM is not sufficient. In this study, the three-dimensional heat conduction was visualized, and the heat transfer coefficient of the interface was quantified as an experimental value. The heat transfer coefficient due to phonon conduction was calculated by the thermal molecular dynamics (MD) method. The results were compared and the relationship between the bonding state of molecules at the filler and resin interface and the heat transfer was found.