The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
005.1
Session ID : 107
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107 Measurement of Biaxial Stress by an Electrodeposited Copper Foil with a Microcircular Hole : Effect of Strain Rate
Seiichiro KITAOKA, Yasuhiro UDA, Junpei YADA
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Keywords: Experimental Stress Analysis, Slip Bands, Microcircular Hole, Biaxial Stress, Strain Rate
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© 2000 The Japan Society of Mechanical Engineers
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