The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
005.1
Session ID : 102
Conference information
102 Behaviors of Fatigue Crack Growth in Sn-3.5Ag-0.7Cu Solder Joints
Ken KAMINISHI, Motoharu TANEDA, Tetsuya ICHIKAWA
Author information
Keywords: Pb-free solder, Joint of surface mount type, Fatigue life, Crack growth
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (354K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2000 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top