The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2002.40
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Measurement of Mean Stress Using Electrodeposited Copper Foil with a Microcircular Hole : Method by Fatigue Crack Propagation
Seiichiro KITAOKA, Yuichi ONO
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Keywords: Experimental Stress Analysis, Fatigue, Crack Propagation rate, Mean Stress, Copper Electroplating Method, Microcircular Hole
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Pages 137-138

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© 2002 The Japan Society of Mechanical Engineers
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