The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2003.41
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Measurement of Biaxial Stress Using Grown Grain Distributed Shape in Electrodeposited Copper Foil with Microcircular Holes
Seiichiro KITAOKA, Yuichi ONO, Kazuki Muramatsu
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Keywords: Experimental Stress Analysis, Biaxial Stress, Stress Concentration, Copper Electroplating Method, Microcircular Hole, Grown Grain
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© 2003 The Japan Society of Mechanical Engineers
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