The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2004.42
Session ID : 222
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FEM Analysis of Thermal Residual Stress Influenced by Material Properties of Elastmer in BOC Package
Satoshi HASHIMOTO, Shozo NAKAMURA
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Keywords: Thermal residual stress, FEM analysis, Solder ball's distraction, Elastmer, BOC package
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© 2004 The Japan Society of Mechanical Engineers
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