The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2004.I
Session ID : 314
Conference information
Numerical Analysis on the Rise in Thermal Conductivity of Rubber Thin Plate Filled with Small Dispersed Particles
Y. Aoyama
Author information
Keywords: Thermal Conductivity, Small Particle Filler, Rubber
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (573K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2004 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top