The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2004.I
Session ID : 121
Conference information
Analysis of residual stress at electronic device solder joints
Eiji Sanemori, Keiji Ogi, Nagatoshi Okabe, Tetsuo Shiraishi
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Keywords: Residual stress, Electronic device, Solder, Joint
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© 2004 The Japan Society of Mechanical Engineers
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