The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2005.43
Session ID : 102
Conference information
102 Measurement of Biaxial Stress Using Grown Grain Distributed Shape in Electrodeposited Copper Foil with Microcircular Holes : Effect of Modulus of Elasticity of the Material
Seiichiro KITAOKA, Yuichi ONO, Kazuki MURAMATSU, Yutaku HASHIMOTO
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Keywords: Experimental Stress Analysis, Principal Stress, Stress Concentration, Grown Grain, Copper Electroplating, Microcircular Hole
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© 2005 The Japan Society of Mechanical Engineers
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