The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2006
Session ID : 208
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208 The Relationship between Fatigue Crack Propagation and Electrical Resistance Change in Resin-Bonded Copper Film
DongHui MA, Tashiyuki TORII, Akira MATSUBA, Kenichi SHIMIZU
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Keywords: Fatigue, Crack propagation, Electrical resistance, Residual stress, Epoxy bonding, Pure copper film
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© 2006 The Japan Society of Mechanical Engineers
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