The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2008.46
Session ID : 210
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210 Correction of Temperature Effect in Damage Monitoring of Joined Interface between Lead-Free Solder Ball and Copper
Naoya TADA, Yusuke EZAKI, Yoshiyuki KOBAYAKAWA
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© 2008 The Japan Society of Mechanical Engineers
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