The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2008.46
Session ID : 220
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220 Effects of Surface Copper Film Bonding on Fatigue Crack Propagation Behavior : Noting Bonding Method and Film Grain Size
Satoshi NAKAMURA, Tashiyuki TORII, Kenichi SHIMIZU, Akira MATSUBA
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© 2008 The Japan Society of Mechanical Engineers
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