The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2009.47
Session ID : 119
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119 Copper Electroplating Stress Measurement Method Using Direction of Grain Growth
Yoshihiro OBATA, Yuichi ONO, Akihiro NAKAO
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Keywords: Experimental Stress Analysis, Fatigue, Nondestructive Inspection, Copper-electroplating Method
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© 2009 The Japan Society of Mechanical Engineers
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