The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2010.48
Session ID : 214
Conference information
214 Three-Dimensional Finite Element Analysis of the Effect of Copper Wire Delamination and Voids on Evaluation of Interface Crack between Solder Ball and Copper by Direct Current Potential Difference Method
Naoto YOSHIDA, Ryoichi NAKAHARA, Naoya TADA
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Keywords: Interface crack, Direct current potential difference method, Void, Copper wire delamination
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© 2010 The Japan Society of Mechanical Engineers
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