The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2024.62
Session ID : 01b5
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Host: The Japan Society of Mechanical Engineers

Name : [in Japanese]

Date : March 08, 2024

Effects of Material Composition of Heat Retention Devices on Thermal Characteristics
*Kazutake UEHARA, Tetsuya OHBAYASHI
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Keywords: Temperature, Dish, Thermal Conductivity, Thermocouple, Powder, Epoxy Resin
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