The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2024.62
Session ID : 03b1
Conference information

Host: The Japan Society of Mechanical Engineers

Name : [in Japanese]

Date : March 08, 2024

Bonding strength of Bi-Zn solder to glass bonded using ultrasonic solder bonding method
*Satoshi KUSHIZAKI, Ryota YAMAMOTO, Koshi HAYASHI, Daisuke YONEKURA
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Keywords: Ultrasonic, Solder joint, Remelting
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© 2024 The Japan Society of Mechanical Engineers
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