The Proceedings of the Dynamics & Design Conference
Online ISSN : 2424-2993
2003
Session ID : 230
Conference information
230 A Base Isolation Device Using Shape Memory Alloy Wires
Yoshitaka YAMASHITAArata MasudaAkira Sone
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
In this paper, we develop two springs using pseudoelastic SMA wire under vending deformation. One of them is called Ring-Type-Spring, and the other is called Buckling-Type-Spring. We also develop a base isolation device using these SMA springs. The response of the base isolation device with each SMA spring is investigated by experiment and equivalent linearization approach and it is clear that every spring has some damping effect. Especially, Buckling-Type-Spring restricts the transmissibility because of its characteristic of restoring force.
Content from these authors
© 2003 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top