Host: The Japan Society of Mechanical Engineers
Name : Dynamics and Design Conference 2018
Date : August 28, 2018 - August 31, 2018
In recent years, there is a great need for lightweight, high stiffness structural technology that can realize fuel efficiency improvement as CO2 reduction measures to prevent global warming. For example, honeycomb panel as lightweight and high stiffness panel is widely applied into various structure. However, honeycomb panel, which needs glue process, is very weak for shear stress and hot temperature. Also rapidly developing home delivery industries need reusable / absorption buffer materials. Therefore, innovative high stiffness structure technologies have been required. In response to these needs, we developed Assembly Truss Core Panel (ATCP) by using origami forming, suggesting the possibility to make much wider range of structure than before, which was reported as lightweight, high stiffness structural technology in 2014. In this paper, we present not only Paper/PP (Polypropylene) shock absorbing buffers as reusable ATCP with no glue, but also studies based on experimental tests by using prototype ATCP and FEM analysis.
