The Proceedings of Design & Systems Conference
Online ISSN : 2424-3078
2003.13
Conference information
Development of Structural Reliability Design System of Printed-Circuit Assembly in Cellular Mobile Phone
Hiroo SAKAMOTOShiro TAKADAHiroyuki NISHIMURAJunko ITOH
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 152-153

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Abstract
This paper presents development of structural reliability design system of printed-circuit assembly in a cellular mobile phone. To realize the reliability design at the early stage of design, an efficient FEM model was proposed, and the fatigue strength database was developed by using 4-point bending test and simulation. The structural reliability design of printed-circuit assembly takes about 30 minutes on entire keys and the estimated life for key pressing operation of trial products was in good agreement with experimental results.
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© 2003 The Japan Society of Mechanical Engineers
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