2201 The Pareto Solution Improvement of the Outline Thermal and Circuit Device Layout Design of the Electronic System by the Self Organization of Modularization Design

Abstract

Until now, the analysis method and the optimization method, which were used in design, were evolving independently. However, when designed combining them, coexistence of time and precision was difficult. Then, we have developed the high-speed first order design method. In this paper, we reconsidered optimization method for our design system. We applied agent-oriented optimization method for "heat conduction problem among devices." In a case study, we achieved more than 10% improvement in pareto curve. We also achieved about 90% shorter design time than former result of this study.