Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : June 29, 2016 - July 01, 2016
Micro-perforated panel (MPP) absorber achieves good sound absorbing performance by reducing the scale of perforation to submillimeter. We have introduced a resin 3D printer in order to manufacture the absorber with small scale perforation. Since resin MPP absorber has less rigidity than metal one it has extra absorption peaks due to the panel elastic vibration. By referring to the past worthwhile researches, we introduce a theoretical acoustic impedance model that accounts vibration of circular plate then we evaluate this model by comparing the experimental results. We also evaluate the sound absorbing performance by changing the geometries of perforation.
