The Proceedings of the Fluids engineering conference
Online ISSN : 2424-2896
2010
Session ID : 0511
Conference information
0511 Development of ultra-high heat flux cooling and ashing-less wafer cooling system using micro-solid spray
Jun IshimotoDaisuke Tan
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
The ultra-high heat flux characteristics and rapid cooling effect of the micro-solid nitrogen (SN_2) spray flow through a two-fluid nozzle to the heated plate was numerically investigated and measured by a new type of integrated simulation technique. Furthermore, PIA mesurement has been applied to clarify the solid-particle diameter profiles of the micro-solid spray, and the wafer resist removal characteristics by thermo-mechanical effect was investigated. Based on the integrated numerical and experimental study, a new type of ultra-high heat flux cryogenic cooling system and the thermomechanical resist removal-cleaning system using cryogenic micro-solid spray was developed.
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© 2010 The Japan Society of Mechanical Engineers
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