Abstract
A method for prediction of particle behavior in semiconductor device manufacturing equipment, in case of wafer inspection equipment operating in atmospheric pressure, was developed. Allowance of particle size has recently been 30 - 50 nm. In this case, the force which is worked on the particle by air flow is mainly drag force. Therefore the trajectory of particle is thought to correspond with the stream line of air flow. The first step, we assigned particle sources on the edge of wafer, where the wafer was sliding with resin chucks. The second step, we simulated air flow and seeked the stream lines through the particle source. The last step, we estimated the approach of the stream lines to the wafer. By considering the estimation, we can control the air flow in the equipment to reduce particles adhering on the wafer.
