Abstract
This study measured temperature distribution and its time variation of a thin plate with a micro-gap channel to investigate cooling condition of flow boiling to guarantee the operation temperature of electronic devices. The thin plate was heated with a thin film heater and the heater was coated with temperature sensitive paint(TSP) made of ruthenium complexes. Highspeed camera recorded the distribution of fluorescence intensity of TSP with the resolution of 0.07mm in space and each intensity was converted into temperature pixel by pixel with the resolution of 0.25℃ in temperature. Flow boiling experiment revealed that stagnant boiling bubbles led to local and temporal temperature rise.
