The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2004.41
Session ID : 113
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Phase Growth Evaluation of Sn-3.0Ag-0.5Cu Solder at Constant Temperature
Atsushi TAKEHARA, Takao MORI, Toshihiko SAYAMA, Takeshi TAKAYANAGI
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Keywords: Phase Growth, Lead-Free Solder, Sn-3.0Ag-0.5Cu
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© 2004 The Japan Society of Mechanical Engineers
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