The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2007.44
Session ID : 813
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813 Development of a thermal network model for a card-type electronic unit : An application of the Build-up Approach (BUA) concept
Tatsuro YOSHIDAMasaru ISHIZUKAShinji NAKAGAWAWataru NAKAYAMA
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© 2007 The Japan Society of Mechanical Engineers
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