The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2008.45
Session ID : 712
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712 Development of thermal analysis model of printed circuit boards for power electronics
Kazumitsu WATANABEMasaru ISHIZUKAShinji NAKAGAWA
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© 2008 The Japan Society of Mechanical Engineers
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