The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2009.46
Session ID : 205
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205 Residual Stress Behavior of Resin on Molding Process considered with Curing Shrinkage
Keiichi NAKASEMasayoshi SHIMIZUTakahito GOSHIMAYoshiya OUGI
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© 2009 The Japan Society of Mechanical Engineers
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