The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2011.48
Session ID : 908
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908 A study on impact stresses in electronic ceramic chips.
Tomohiro lnagaki, Satoshi Nishide, Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita
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Keywords: Ceramic Chip, Hopkinson Bar Test, Impact Stress, Three Points Bending, Numerical Simulation
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© 2011 The Japan Society of Mechanical Engineers
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