The Proceedings of Conference of Hokuriku-Shinetsu Branch
Online ISSN : 2424-2772
2014.51
Session ID : 601
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601 Interaction between Creep and Fatigue Damages for Sn-3.0Ag-0.5Cu Lead Free Solder Material
Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
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Keywords: Creep, Fatigue, Creep-fatigue Interaction, Creep damage, Fatigue damage
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© 2014 The Japan Society of Mechanical Engineers
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