Abstract
The integration of micro-parts in alignment with an integrated circuit is a highly important task in assembly process. In any case, a uni-directional control is required since dies, packaging or optical elements, i.e. LED etc., must be positioned to the corresponding sites of the substrate with the correct angular orientation. In this paper, in order to determine an optimum pattern for both the micro-parts and the binding sites, the self-alignment has been comparatively studied using five kinds of modified patterns designed and considered from view point of Overlap ratio, based on a capillary effect.
