The Proceedings of the Conference on Information, Intelligence and Precision Equipment : IIP
Online ISSN : 2424-3140
2007
Session ID : 2318
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2318 Heat Dissipation and Mounting Technologies of LED Module
Kimihiko SUDONorio NAKAZATOTakaaki MARUYAMA
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Abstract
We developed a light source module using a high-power light emitting diode (LED). Production of long life LED chips requires the thermal resistance of its LED module to be reduced. We analyzed thermal conductivity in an electrically conductive adhesive used in a LED module. Results confirmed that the thermal conductivity of an electrically conductive adhesive, including contact thermal resistance, is important when analyzing thermal conduction in a LED module.
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© 2007 The Japan Society of Mechanical Engineers
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