Abstract
This paper describe about deliberation of TEG (Test Element Group) for MEMS (Micro Electro Mechanical Systems) electrostatic actuator. We entertain three type of TEG. First TEG is for measuring spring constant by bringing displacement given by comb-drive. Second TEG is for measuring energy dissipation on viscosity, structural and boundary face. Last one is for measuring effect by mismatched designed parameters on wafer by fabrication process. We employ these TEG for verifying MEMS equivalent circuit simulation and feature of devices fabricated in block on Si wafer.
