Abstract
In electronic device, conductive adhesive is widely used to connect devices electrically and mechanically. Usually, the connection area has Au plating, however, it costs too much. Therefore, we studied using conductive adhesive without Au plating. In this case, the main problem is corrosion at the interface between conductive adhesive and stainless steel, and it causes insulation problem at the interface. The insulation takes place depending on time. So, if the interface has enough life until insulation, it is not serious problem. In this paper, we studied life of the interface using Highly Accelerated Temperature and Humidity Stress Test (HAST) chamber. The life was described by water vapor pressure Vp, and it decreased in proportion to the 4.307^<th> power of Vp. And HAST results showed that the interface without Au plating had enough life in actual use.
