Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : March 14, 2016 - March 15, 2016
In grinding, it is effective to use micro-particle grinding wheels to create high quality ground surfaces. However, the finer the abrasives used, the more problematic will the aggregateing of the abrasives be during the fabrication of the wheel. In this study, we aimed to resolve this problem by applying PELID to evenly disperse the microabrasives while laminating the grinding wheel. As a result of investigations, it was found that the microabrasives can be evenly dispersed over conductive substrates by PELID, but dispersion onto nonconductive substrates is uneven due to the charge-up of the substrate. Based on these findings, we proposed a new twin-nozzle PELID method, carried out experiments on dispersion on nonconductive substrates.
