Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : March 06, 2023 - March 07, 2023
We propose a measurement technique for visualization of thermal distribution on a heated surface in three-dimensional (3D). Our proposed method integrates temperature-sensitive paint (TSP) and phase-shift profilometry that use structured light. Compared to previous thermal measurements, TSP can provide full field measurements. On the other hands, phase-shift profilometry using structured light can provide non-contact measurements. To validate the proposed method, 3D temperature distributions on a hemisphere were measured. Then, we measured the temperature distributions of the hemisphere under localized cooling. 3D thermal measurement technique that uses TSP and phase-shift profilometry is useful method for investigating the temperature distribution on 3D structure’s surface.
