Abstract
We report a novel method for nanomechanical characterization and Young's modulus determination of a nanosize silicon (100) tip cutting tool. These tools (aspect ratio >1 : 10) are shaped using focused ion beam (FIB) machining. Currently, we are developing a novel nanometer-scale mechanical machining system-on-a-chip (SOAC) based on these tools. Thus, proper characterization of their mechanical properties is of significant importance for top-down nanomanufacturing. Real time imaging of the controlled bending of this nano tool was performed in situ in the transmission electron microscope (TEM) utilizing a unique piezo-controlled in-situ indenter. Nanomechanical analysis was performed by coupling video frames of the bending behavior with calibrated voltage data from piezo crystal. This permits direct determination of the Young's modulus of the nano tool. Nanomechanical analysis was also performed using finite element analysis (FEA).
