Abstract
On YAG laser soldering, the solderability of two types Pb-free alloy (Sn-43Bi and Sn-2Ag-5Bi-0.5Cu) and Sn-37Pb solder pastes were examined. Experiments were performed in order to obtain the range of processing parameters (laser power density, and irradiation time) appropriate to soldering with wetting angle<90°. Joint strength of chip component soldered on printed circuit board (Glass epoxy) was tested on coating thickness (0.2, 0.3, and 0.4mm) of solder paste. As a result, characteristic of Sn-2Ag-5Bi-0.5Cu solder paste was almost equal to that of Sn-63Pb solder paste.
