The Proceedings of Conference of Kansai Branch
Online ISSN : 2424-2756
2000.75
Session ID : 213
Conference information
213 Measurements of Micro-deformation of Several Material at Low Temperatures Using Electronic Speckle Pattern Interferometry
Atsushi NISHIGUCHI, Sumio NAKAHARA, Shigeyoshi HISADA, Takeyoshi FUJITA
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Keywords: Electronic speckle pattern interferometry, Thermal Expansion coefficient, Thermal Strain
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© 2000 The Japan Society of Mechanical Engineers
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