Abstract
This paper describes the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast and slow-slow strain waves. Linear damage rule, ductility exhaustion model and a method based on the strain rate ratio were applied to the experimental data. The strain rate ratio method could predict the creep-fatigue lives better than the other methods. The data estimated by the strain rate ratio method were within the scatter band of a factor of two.
