The Proceedings of Conference of Kansai Branch
Online ISSN : 2424-2756
2010.85
Session ID : 321
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321 Selection Precept of Underfill Resin to Improving Thermal Fatigue Life for Solder Joints of LSI Device
Norihiro KOBAYASHI, Masahiro KUSAKA, Masaaki KIMURA, Koichi KAIZU
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© 2010 The Japan Society of Mechanical Engineers
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